Tzu-Kun Ku: search on Z-Library

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1

Impact of interface nature on deep sub-micron Al-plug resistance

Bing-Yue Tsui, Tsung-Ju Yang, Tzu-Kun Ku

Journal:

Microelectronics Reliability

Year:

2001

Language:

english

File:

PDF, 872 KB

english, 2001

2

Sidewall profile engineering for the reduction of cut exposures in self-aligned pitch division patterning

Chen, Frederick T., Chen, Wei-Su, Tsai, Ming-Jinn, Ku, Tzu-Kun

Journal:

Journal of Micro/Nanolithography MEMS and MOEMS

Year:

2014

Language:

english

File:

PDF, 4.58 MB

english, 2014

3

Effects of Slurry in Cu Chemical Mechanical Polishing (CMP) of TSVs for 3-D IC Integration

Jui-Chin Chen, Lau, J.H., Pei-Jer Tzeng, Shang-Chun Chen, Chien-Ying Wu, Chien Chou Chen, Yu Chen Hsin, Yi-Feng Hsu, Shang Hung Shen, Sue-Chen Liao, Chi-Hon Ho, Cha-Hsin Lin, Tzu-Kun Ku, Ming-Jer Kao

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2012

Language:

english

File:

PDF, 1.76 MB

english, 2012

4

SPIE Proceedings [SPIE SPIE Advanced Lithography - San Jose, California (Sunday 12 February 2012)] Advanced Etch Technology for Nanopatterning - Transfer optimized dry development process of sub-32nm HSQ/AR3 BLR resist pillar from low-K etcher to metal etcher

Chen, Wei-Su, Chen, Peng-Sheng, Wei, Hung-Wen, Chen, Frederick T., Tsai, Ming-Jinn, Ku, Tzu-Kun, Zhang, Ying

Year:

2012

Language:

english

File:

PDF, 6.15 MB

english, 2012

5

A High Layer Scalability TSV-Based 3D-SRAM With Semi-Master-Slave Structure and Self-Timed Differential-TSV for High-Performance Universal-Memory-Capacity-Platforms

Meng-Fan Chang,, Chih-Sheng Lin,, Wei-Cheng Wu,, Ming-Pin Chen,, Yen-Huei Chen,, Zhe-Hui Lin,, Shyh-Shyuan Sheu,, Tzu-Kun Ku,, Cha-Hsin Lin,, Yamauchi, H.

Journal:

IEEE Journal of Solid-State Circuits

Year:

2013

Language:

english

File:

PDF, 2.28 MB

english, 2013

6

Fabrication and Characterization of Diamond-Clad Silicon Field Emitter Arrays

Cheng, Huang-Chung, Ku, Tzu-Kun, Hsieh, Biing-Bang, Chen, Sheng-Hsiung, Leu, Shye-Yuh, Wang, Chih-Chong, Chen, Chia-Fu, Hsieh, Iing-Jar, Huang, Jammy C. M.

Journal:

Japanese Journal of Applied Physics

Year:

1995

File:

PDF, 2.71 MB

1995

7

[IEEE 2015 Symposium on VLSI Circuits - Kyoto, Japan (2015.6.17-2015.6.19)] 2015 Symposium on VLSI Circuits (VLSI Circuits) - RRAM-based 7T1R nonvolatile SRAM with 2x reduction in store energy and 94x reduction in restore energy for frequent-off instant-on applications

Lee, Albert, Chang, Meng-Fan, Lin, Chien-Chen, Chen, Chien-Fu, Ho, Mon-Shu, Kuo, Chia-Chen, Tseng, Pei-Ling, Sheu, Shyh-Shyuan, Ku, Tzu-Kun

Year:

2015

Language:

english

File:

PDF, 526 KB

english, 2015

8

[IEEE IEEE 2000 International Interconnect Technology Conference - Burlingame, CA, USA (5-7 June 2000)] Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) - CVD Cu technology development for advanced Cu interconnect applications

Cheng-Hong Lee,, Kuei-Hung Shen,, Tzu-Kun Ku,, Cheng-Hung Luo,, Chia-Chun Tao,, Hung-Wen Chou,, Chin Hsia,

Year:

2000

Language:

english

File:

PDF, 352 KB

english, 2000

9

Write Scheme Allowing Reduced LRS Nonlinearity Requirement in a 3D-RRAM Array With Selector-Less 1TNR Architecture

Chen, Frederick T., Chen, Yu-Sheng, Wu, Tai-Yuan, Ku, Tzu-Kun

Journal:

IEEE Electron Device Letters

Year:

2014

Language:

english

File:

PDF, 612 KB

english, 2014

10

SPIE Proceedings [SPIE SPIE Advanced Lithography - San Jose, California, USA (Sunday 24 February 2013)] Advanced Etch Technology for Nanopatterning II - Sub-30nm TiN/Ti/HfOx pillar formed by tone reverse processes for RRAM applications

Chen, Wei-Su, Chen, Peng-Sheng, Chen, Hong Chih, Wei, Hung-Wen, Chen, Frederick T., Ku, Tzu-Kun, Zhang, Ying, Oehrlein, Gottlieb S., Lin, Qinghuang

Year:

2013

Language:

english

File:

PDF, 2.46 MB

english, 2013

11

[IEEE 2013 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) - Hsinchu (2013.4.22-2013.4.24)] 2013 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) - Good memory performance and coexistence of bipolar and unipolar resistive switching for CMOS compatible Ti/HfOx/W memory

Kan-Hsueh Tsai,, Pang-Shiu Chen,, Tai-Yuan Wu,, Yu-Sheng Chen,, Heng-Yuan Lee,, Wei-Su Chen,, Chen-Han Tsai,, Pei-Yi Gu,, Rahaman, S. Z., Yu-De Lin,, Chen, F., Ming-Jinn Tsai,, Tzu-Kun Ku,

Year:

2013

Language:

english

File:

PDF, 577 KB

english, 2013

12

Fabrication and Characterization of Various Carbon-Clad Silicon Microtips with Ultra-Small Tip Radii

Tarntair, Fu-Gow, Hong, Wei-Kai, Ku, Tzu-Kun, She, Nan-Jie, Chen, Chia-Fu, Cheng, Huang-Chung

Journal:

Japanese Journal of Applied Physics

Year:

2000

Language:

english

File:

PDF, 333 KB

english, 2000

13

[IEEE 2015 Symposium on VLSI Technology - Kyoto, Japan (2015.6.16-2015.6.18)] 2015 Symposium on VLSI Technology (VLSI Technology) - RRAM-based 7T1R nonvolatile SRAM with 2x reduction in store energy and 94x reduction in restore energy for frequent-off instant-on applications

Lee, Albert, Chang, Meng-Fan, Lin, Chien-Chen, Chen, Chien-Fu, Ho, Mon-Shu, Kuo, Chia-Chen, Tseng, Pei-Ling, Sheu, Shyh-Shyuan, Ku, Tzu-Kun

Year:

2015

Language:

english

File:

PDF, 617 KB

english, 2015

14

Area-Efficient Embedded Resistive RAM (ReRAM) Macros Using Logic-Process Vertical-Parasitic-BJT (VPBJT) Switches and Read-Disturb-Free Temperature-Aware Current-Mode Read Scheme

Chang, Meng-Fan, Kuo, Chia-Chen, Sheu, Shyh-Shyuan, Lin, Chorng-Jung, King, Ya-Chin, Chen, Frederick T., Ku, Tzu-Kun, Tsai, Ming-Jinn, Wu, Jui-Jen, Chih, Yue-Der

Journal:

IEEE Journal of Solid-State Circuits

Year:

2014

Language:

english

File:

PDF, 2.20 MB

english, 2014

15

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Effects of etch rate on scallop of through-silicon vias (TSVs) in 200mm and 300mm wafers

Hsin, Yu-Chen, Chen, Chien-Chou, Lau, John H., Tzeng, Pei-Jer, Shen, Shang-Hung, Hsu, Yi-Feng, Chen, Shang-Chun, Wn, Chien-Ying, Chen, Jui-Chin, Ku, Tzu-Kun, Kao, Ming-Jer

Year:

2011

Language:

english

File:

PDF, 3.21 MB

english, 2011

16

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Electrical testing of blind Through-Silicon Via (TSV) for 3D IC integration

Hung, Jui-Feng, Lau, John H., Chen, Peng-Shu, Wu, Shih-Hsien, Lai, Shinn-Juh, Li, Ming-Lin, Sheu, Shyh-Shyuan, Tzeng, Pei-Jer, Lin, Zhe-Hui, Ku, Tzu-Kun, Lo, Wei-Chung, Kao, Ming-Jer

Year:

2012

Language:

english

File:

PDF, 3.26 MB

english, 2012

17

SPIE Proceedings [SPIE SPIE Advanced Lithography - San Jose, California, USA (Sunday 24 February 2013)] Advances in Resist Materials and Processing Technology XXX - Sub-14 nm HSQ line patterning by e-beam dose proximity effect correction assisted with designed line CD/pitch split

Chen, Wei-Su, Yang, Chu-Ya, Lo, Chiung Yu, Wei, Hung-Wen, Chen, Frederick T., Ku, Tzu-Kun, Somervell, Mark H.

Year:

2013

Language:

english

File:

PDF, 1.13 MB

english, 2013

18

Set-Triggered-Parallel-Reset Memristor Logic for High-Density Heterogeneous-Integration Friendly Normally Off Applications

Chang, Meng-Fan, Yang, Shu-Meng, Kuo, Chia-Chen, Yang, Ting-Chin, Yeh, Che-Ju, Chien, Tun-Fei, Huang, Li-Yue, Sheu, Shyh-Shyuan, Tseng, Pei-Ling, Chen, Yu-Sheng, Chen, Frederick T., Ku, Tzu-Kun, Tsai,

Journal:

IEEE Transactions on Circuits and Systems II: Express Briefs

Year:

2015

Language:

english

File:

PDF, 1.23 MB

english, 2015

19

Characterization and Fabrication of Chimney-Shaped Metal Field Emitters

Cheng, Huang-Chung, Wang, Chih-Chong, Ku, Tzu-Kun, Hsieh, Iing-Jar

Journal:

Japanese Journal of Applied Physics

Year:

1996

File:

PDF, 1.51 MB

1996

20

Evidences of Reactive-Ion-Etching-Induced Damages to the Ferromagnet of Perpendicular Magnetic Tunnel Junctions

Chien, Cheng-Wei, Wang, Ding-Yeong, Shen, Kuei-Hung, Huang, Sheng-Huang, Kuo, Keng-Ming, Yang, Shan-Yi, Wang, Yung-Hung, Ku, Tzu-Kun, Deng, Duan-Li

Journal:

IEEE Electron Device Letters

Year:

2013

Language:

english

File:

PDF, 469 KB

english, 2013

21

SPIE Proceedings [SPIE SPIE Advanced Lithography - San Jose, California (Sunday 12 February 2012)] Optical Microlithography XXV - Complementary polarity exposures for cost-effective line-cutting in multiple patterning lithography

Chen, Frederick T., Chen, Wei-Su, Tsai, Ming-Jinn, Ku, Tzu-Kun, Conley, Will

Year:

2012

Language:

english

File:

PDF, 501 KB

english, 2012

22

[IEEE 2015 IEEE International Solid- State Circuits Conference - (ISSCC) - San Francisco, CA, USA (2015.2.22-2015.2.26)] 2015 IEEE International Solid-State Circuits Conference - (ISSCC) Digest of Technical Papers - 17.5 A 3T1R nonvolatile TCAM using MLC ReRAM with Sub-1ns search time

Chang, Meng-Fan, Lin, Chien-Chen, Lee, Albert, Kuo, Chia-Chen, Yang, Geng-Hau, Tsai, Hsiang-Jen, Chen, Tien-Fu, Sheu, Shyh-Shyuan, Tseng, Pei-Ling, Lee, Heng-Yuan, Ku, Tzu-Kun

Year:

2015

Language:

english

File:

PDF, 694 KB

english, 2015

23

[IEEE 2014 IEEE 12th International Conference on Solid -State and Integrated Circuit Technology (ICSICT) - Guilin, China (2014.10.28-2014.10.31)] 2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) - Challenges at circuit designs for resistive-type Nonvolatile memory and nonvolatile logics in mobile and cloud applications

Chang, Meng-Fan, Lee, Albert, Kuo, Chia-Chen, Sheu, Shyh-Shyuan, Chen, Fredrick T., Ku, Tzu-Kun, Liu, Yong-Pan, Yang, Hua-Zhong, Chen, Ping-Cheng

Year:

2014

Language:

english

File:

PDF, 655 KB

english, 2014

24

Excellent Emission Characteristics of Tunneling Oxides Formed Using Ultrathin Silicon Films for Flash Memory Devices

Wang, Ping-Wei, Ku, Tzu-Kun, Su, Huan-Ping, Hong, Gary, Cheng, Huang-Chung

Journal:

Japanese Journal of Applied Physics

Year:

1996

Language:

english

File:

PDF, 386 KB

english, 1996

25

Performance Comparison and Design Issue on Different GaN Power Transistor Structures

Lee, Chwan-Ying, Hung, Chien-Chung, Kuo, Wei-Hung, Chen, Young-Shying, Lee, Lurng-Shehng, Yen, Cheng-Tyng, Lin, Suh-Fang, Xuan, Rong, Ku, Tzu-Kun, Tsai, Ming-Jinn

Journal:

MRS Proceedings

Year:

2012

Language:

english

File:

PDF, 411 KB

english, 2012

26

Challenges and Circuit Techniques for Energy-Efficient On-Chip Nonvolatile Memory Using Memristive Devices

Chang, Meng-Fan, Lee, Albert, Chen, Pin-Cheng, Lin, Chrong Jung, King, Ya-Chin, Sheu, Shyh-Shyuan, Ku, Tzu-Kun

Journal:

IEEE Journal on Emerging and Selected Topics in Circuits and Systems

Year:

2015

Language:

english

File:

PDF, 2.61 MB

english, 2015

27

Low-Power MCU With Embedded ReRAM Buffers as Sensor Hub for IoT Applications

Chien, Tsai-Kan, Chiou, Lih-Yih, Sheu, Shyh-Shyuan, Lin, Jing-Cian, Lee, Chang-Chia, Ku, Tzu-Kun, Tsai, Ming-Jinn, Wu, Chih-I

Journal:

IEEE Journal on Emerging and Selected Topics in Circuits and Systems

Year:

2016

Language:

english

File:

PDF, 2.50 MB

english, 2016

28

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - An innovative bumpless stacking with through silicon via for 3D Wafer-on-Wafer (WOW) integration

Liao, Sue-Chen, Chen, Erh-Hao, Chen, Chien-Chou, Chen, Shang-Chun, Chen, Jui-Chin, Chang, Po-Chih, Chang, Yiu-Hsiang, Lin, Cha-Hsin, Ku, Tzu-Kun, Kao, Ming-Jer, Kim, Young Suk, Maeda, Nobuhide, Kodama

Year:

2014

Language:

english

File:

PDF, 952 KB

english, 2014

29

[IEEE 2015 20th Asia and South Pacific Design Automation Conference (ASP-DAC) - Chiba, Japan (2015.1.19-2015.1.22)] The 20th Asia and South Pacific Design Automation Conference - Read circuits for resistive memory (ReRAM) and memristor-based nonvolatile Logics

Meng-Fan Chang,, Albert Lee,, Chien-Chen Lin,, Mon-Shu Ho,, Ping-Cheng Chen,, Chia-Chen Kuo,, Ming-Pin Chen,, Pei-Ling Tseng,, Tzu-Kun Ku,, Chien-Fu Chen,, Kai-Shin Li,, Jia-Min Shieh,

Year:

2015

Language:

english

File:

PDF, 1.26 MB

english, 2015

30

SPIE Proceedings [SPIE SPIE Advanced Lithography - San Jose, California (Sunday 12 February 2012)] Advances in Resist Materials and Processing Technology XXIX - Substrate and underlayer dependence of sub-32nm e-beam HSQ pillar patterning process for RRAM application

Chen, Wei-Su, Chen, Peng-Sheng, Wei, Hung-Wen, Chen, Frederick T., Tsai, Ming-Jinn, Ku, Tzu-Kun, Somervell, Mark H., Wallow, Thomas I.

Year:

2012

Language:

english

File:

PDF, 6.07 MB

english, 2012

31

[IEEE IEEE 1999 International Interconnect Technology Conference - San Francisco, CA, USA (24-26 May 1999)] Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) - A high aspect ratio sub 0.2 micron Al plug technology for 0.13 μm generation

Tsung-Ju Yang,, Tzu-Kun Ku,, Tze-Liang Lee,, Bing-Yue Tsui,, Lai-Juh Chen,, Chin Hsia,

Year:

1999

Language:

english

File:

PDF, 360 KB

english, 1999

32

Novel Defects-Trapping ${\rm TaO}_{\rm X}/{\rm HfO}_{\rm X}$ RRAM With Reliable Self-Compliance, High Nonlinearity, and Ultra-Low Current

Chen, Yu-Sheng, Lee, Heng-Yuan, Chen, Pang-Shiu, Chen, Wei-Su, Tsai, Kan-Hsueh, Gu, Pei-Yi, Wu, Tai-Yuan, Tsai, Chen-Han, Rahaman, S. Z., Lin, Yu-De, Chen, Frederick, Tsai, Ming-Jinn, Ku, Tzu-Kun

Journal:

IEEE Electron Device Letters

Year:

2014

Language:

english

File:

PDF, 660 KB

english, 2014

33

[IEEE 2015 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) - Hsinchu, Taiwan (2015.4.27-2015.4.29)] 2015 International Symposium on VLSI Technology, Systems and Applications - Low-cost 3DIC process technologies for wide-I/O memory cube

Chen, Jui-Chin, Chen, Erh-Hao, Tzeng, Pei-Jer, Lin, Cha-Hsin, Wang, Chung-Chih, Chen, Shang-Chun, Hsu, Tzu-Chien, Chen, Chien-Chou, Hsin, Yu-Chen, Chang, Po-Chih, Chang, Yiu-Hsiang, Ku, Tzu-Kun

Year:

2015

Language:

english

File:

PDF, 509 KB

english, 2015

34

Fabrication and Characterization of the Pd-Silicided Emitters for Field-Emission Devices

Wang, Chih-Chong, Ku, Tzu-Kun, Hsieh, Iing-Jar, Cheng, Huang-Chung

Journal:

Japanese Journal of Applied Physics

Year:

1996

File:

PDF, 1.54 MB

1996

35

SPIE Proceedings [SPIE SPIE Advanced Lithography - San Jose, California, United States (Sunday 24 February 2013)] Optical Microlithography XXVI - Sidewall profile inclination modulation mask (SPIMM): modification of an attenuated phase-shift mask for single-exposure double and multiple patterning

Conley, Will, Chen, Frederick T., Chen, Wei-Su, Tsai, Ming-Jinn, Ku, Tzu-Kun

Year:

2013

Language:

english

File:

PDF, 721 KB

english, 2013

36

[IEEE 2015 International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM) - Hsin-Chu, Taiwan (2015.11.16-2015.11.18)] 2015 International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM) - A millimeter-wave on-chip antenna using 0.15um pHEMT process

Jeng-Hau Lu,, Jou, Christina F., Lin-Kun Wu,, Sue-Chen Liao,, Pei-Ling Tseng,, Tzu-Kun Ku,

Year:

2015

Language:

english

File:

PDF, 391 KB

english, 2015

37

[IEEE 2015 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) - Hsinchu, Taiwan (2015.4.27-2015.4.29)] 2015 International Symposium on VLSI Technology, Systems and Applications - A complementary magnetic field sensor using magnetic tunnel junction

Wang, Ding-Yeong, Kuo, Keng-Ming, Chien, Cheng-Wei, Yang, Shan-Yi, Huang, Sheng-Huang, Shyu, Jia-Hong, Shen, Kuei-Hung, Ku, Tzu-Kun, Tsai, Ming-Jinn

Year:

2015

Language:

english

File:

PDF, 305 KB

english, 2015

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